DesignCon 2027
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About DesignCon
DesignCon is an annual conference and expo in Silicon Valley for chip, board and systems design engineers, run by Informa Markets. It pairs a multi-track engineering conference on signal and power integrity and high-speed design with an expo of design tools and suppliers.
DesignCon 2027
DesignCon runs February 2–4, 2027 at Santa Clara Convention Center, Santa Clara.
What it is
Informa Markets bills DesignCon as "the premier high-speed communications and system design conference and exposition." It serves chip, board and systems design engineers, with education on signal and power integrity, high-speed link design, packaging and interconnects. On the expo floor, suppliers show the latest in high-speed design tools and technologies, with live product demos at their booths.
Conference and expo run on different days
The expo is open for only two of the three days, so plan floor time accordingly:
- Conference: Tuesday, February 2, 9 a.m.–6 p.m.; Wednesday, February 3 and Thursday, February 4, 8 a.m.–5:15 p.m.
- Expo: Wednesday, February 3 and Thursday, February 4, 11 a.m.–6 p.m.
The conference program
The three-day conference, written by a Technical Program Committee of industry engineers, is organized into 15 tracks. Tracks for 2027 include signal and power integrity for multi-die, interposer and packaging; chip I/O and power modeling; optimizing high-speed link design; power integrity in power delivery systems; electromagnetic compatibility and interference; machine learning and AI for microelectronics; and advanced automotive electronics. Sessions come in four formats:
- all-day boot camps on core concepts
- three-hour tutorials
- 75-minute panel discussions
- 45-minute technical paper sessions
On the expo floor
The Chiphead Theater runs free presentations, workshops, demos and panels. Keynotes are open to all package types, and the expo program includes awards ceremonies for the Engineer of the Year and Best Paper Awards. Daily booth bar crawls, meet-and-greets around the expo floor, round out each expo day.
Key Topics
- Signal and power integrity
- High-speed link design
- PCB materials and packaging
- Test and measurement
- Electromagnetic compatibility
- Chiplet and 3DIC integration
Quick Info
- Dates
- February 2, 2027 – February 4, 2027
- Location
- Santa Clara
United States - Organizer
- Informa Markets
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